AL Aluminum Metallized Polyimide Film
Description:
AL Aluminum Metallized Polyimide Film consists of a polyimide film coated with aluminum on one side. It not only has excellent low and high temperature resistance, solvent resistance, radiation resistance, and flame resistance, but also has EMI shielding and high thermal conductivity.
Characteristics
• EMI shielding
• High thermal conductivity
• Good radiation resistance
• High temperature resistance
Application:
AL Aluminum Metallized Polyimide Film can be used in a wide range of industries where EMI shielding and efficient thermal energy transfer are required.
• EMI Shielding Materials
• Conductive Materials
• Military applications
• Satellite and Space applications
Technical Data:
Property |
Units |
Aluminum Metallized Polyimide Film Typical Value |
LR-PI 100AM |
LR-PI 200AM |
Backing Thickness |
¦Ìm |
25 |
50 |
Aluminum Thickness |
¦Ìm |
0.2-0.5 |
0.2-0.5 |
Tensile Strength |
MPa |
¡Ý140 |
¡Ý130 |
Elongation |
% |
¡Ý45 |
¡Ý45 |
Shrinkage, at 150¡æ |
% |
0.20 |
0.20 |
Surface Resistivity |
The side of PI Film |
¦¸ |
¡Ý1X1012 |
¡Ý1X1012 |
The side of Aluminum |
¦¸ |
<103 |
<103 |
Roll Size: 3" paper or plastic core, from 6mm width upward, standard width 520mm.
Special thickness or combinations can be supplied per customer¡¯s request
Note: The technical information, data, recommendations, and other statements provided are based on tests or research which we believe to be reliable, but such information shall in no event constitute a warranty of any kind by Liren. Before using this product, all purchasers should carefully evaluate its suitability for their intended applications.